FOPLP也正凭借规模化优势快速崛起，被视为CoWoS的潜在继任者。FOWLP基于圆形晶圆进行封装，由于晶圆形状为圆盘状，边缘区域难以充分利用，导致芯片放置面积较小。尺寸与利用率优势是FOPLP的核心竞争力。FOPLP采用方形大尺寸面板作为载板，而非8英寸或12英寸晶圆。
Technicians are trying to diagnose a helium flow problem in the upper stage of the moon rocket ahead of Artemis II, which could launch as early as April.
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Today's actuators, even the state-of-the-art ones, are still largely made from metals, hard plastics and electronics. But there are other ideas around. Tolley and his colleagues have been working on a very different approach.